Semiconductor Modeling: For Simulating High-Speed Designs

Seitenzahl:

768

Gewicht:

1433 g

Erschienen bei:

Springer Verlag GmbH

Kurzbeschreibung

Semiconductor Modeling: For Simulating Signal, Power, and Electromagnetic Integrity assists engineers - both recent graduates and working product designers - in designing high-speed circuits. The authors apply circuit theory, circuit simulation tools, and practical experience to help the engineer understand semiconductor modeling as applied to high-speed digital designs. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. The text addresses many practical considerations, including process variation, model accuracy, validation and verification, signal integrity, and design flow. Readers will benefit from its survey of modeling for semiconductors, packages, and interconnects, along with usable advice on how to get complex, high-speed prototypes to work on the first try.
Highlights include:
- Presents a very complete and well-balanced treatment of modeling of semiconductors, packages, and interconnects. Facilitates reader comprehension of the whole field of high-speed modeling, including digital and RF circuits.
- Combines practical modeling techniques with the latest EDA tools for simulation and successful high-speed digital design. Facilitates resolution of practical, every-day problems.
- Presents modeling from its historical roots to current state of the art. Facilitates keeping abreast of the latest modeling developments as they continue to unfold.
- Includes a CD-ROM with modeling software and additional model examples. TOC:Part 1: Introduction.- How the Workplace Supports Successful Design.- Introduction to Modeling Concepts.- Part 2: Generating Models.- Model Properties Derived from Device Physics Theory.- Measuring Model Properties in the Laboratory.- Using Statistical Data to Characterize Component Populations.- Part 3: Selecting Components and Their Models.- Using Selection Guides to Compare and Contrast Components.- Using Data Sheets to Compare and Contrast Components.- Selecting the Best Model for a Simulation.- Modeling and Simulation in the Design Process Flow.- Part 4: About the IBIS Model.- Key Concepts of the IBIS Specification.- Using IBIS Models in What-If Simulations.- Fixing Errors and Omissions in IBIS Models.- Using EDA Tools to Create and Validate IBIS Models from SPICE.- Part 5: Managing Models.- Sources of IBIS Models.- Working with the Model Library.- Part 6: Model Accuracy and Verification.- Methodology for Verifying Models.- Verifying Model Accuracy by Using Laboratory Measurements.- Balancing Accuracy Against Practicality When Correlating Simulation Results.- Deriving an Equation-Based Model From a Macromodel.- Part 7: Future Directions in Modeling.- The Challenge to IBIS.- Feedback to the Model Provider Improves Model Accuracy.- Future Trends in Modeling.- Using Probability: The Ultimate Future of Simulation.- Part 8: Glossary, Bibliography, Index, and CD-ROM.- Glossary.- Bibliography.- Index.- Appendix A. Sample Data Sheets.- Appendix B. Sample IBIS Model Files.- Appendix C. Sample SPICE Models.- Appendix D. Sample S-Parameter Model.- Appendix E. Key Concepts of the IBIS Model.- Appendix F: List of Websites.- Appendix G. List of Software Providers.- Appendix H. Production Realities.- Appendix I. IBIS Quality Checklist.- Appendix J. Device Physics.- Appendix K. Logic Selection Guides.- Appendix L. Training Presentations.- Software: Mentor Graphics: Visual IBIS Editor.- Software: Sonnet Software: Sonnet Lite.

Beschreibung

Semiconductor Modeling: For Simulating Signal, Power, and Electromagnetic Integrity assists engineers – both recent graduates and working product designers – in designing high-speed circuits. The authors apply circuit theory, circuit simulation tools, and practical experience to help the engineer understand semiconductor modeling as applied to high-speed digital designs. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. The text addresses many practical considerations, including process variation, model accuracy, validation and verification, signal integrity, and design flow. Readers will benefit from its survey of modeling for semiconductors, packages, and interconnects, along with usable advice on how to get complex, high-speed prototypes to work on the first try.
Highlights include:
- Presents a very complete and well-balanced treatment of modeling of semiconductors, packages, and interconnects. Facilitates reader comprehension of the whole field of high-speed modeling, including digital and RF circuits.
- Combines practical modeling techniques with the latest EDA tools for simulation and successful high-speed digital design. Facilitates resolution of practical, every-day problems.
- Presents modeling from its historical roots to current state of the art. Facilitates keeping abreast of the latest modeling developments as they continue to unfold.

- Includes a CD-ROM with modeling software and additional model examples.

Portrait

Mehr über...

Mehr über:  Technology & Industrial Arts, Simulation, Halbleiter, Model, Circuit Design, Semiconductor Modeling, Power, SPICE, EMC, IBIS, Engineering - Electrical & Electronic, Electronics - Semiconductors, Electronics - Circuits - Printed, Signal Integrity

Mehr von: 

Mehr von:  Lynne Green, Roy Leventhal, Springer Verlag GmbH